ISCO-08 8189
Stationary plant and machine operators not elsewhere classified
17.5%
ADI · 311th of 433 · 95% interval 8.5–26.8
An AI agent can at least partly carry out 17.5% of the task time of stationary plant and machine operators not elsewhere classified, and finish 1.6% alone. The barrier that holds most of the rest back is access to the systems the work runs on.
ADI · partial or full17.5%
311th of 433 · interval 8.5–26.8
ADI3 · full delegation1.6%
127th of 433 · interval 0.0–5.2
ADIs · share of time21.0%
304th of 433 · interval 16.5–26.1
Evidence74
task statements rated by two models and weighted by importance and frequency. World employment: 0.6 million.
Task weight by level
How the tasks rate
L0No meaningful role · 48.1%L1Augmentation · 34.4%L2Partial delegation · 15.9%L3Full delegation · 1.6%
Barriers
What stops the agent
Share of task weight flagged by each barrier; a task can carry several.
74 task statements, heaviest first
| Task statement (O*NET occupation) | Weight | Level | Sonnet · Haiku | Share | Human time | Barriers |
|---|---|---|---|---|---|---|
| Observe packages moving along conveyors to identify packages, detect defective packaging, and perform quality control.Conveyor Operators and Tenders · supplemental task | 2.2% | L1 | L2L1 | 42% | 4.3 h | Physical presence, Access to systems |
| Inspect materials, components, or products for surface defects and measure circuitry, using electronic test equipment, precision measuring instruments, microscope, and standard procedures.Semiconductor Processing Technicians | 2.1% | L1 | L1L1 | 22% | 30 min | Physical presence, Access to systems |
| Maintain processing, production, and inspection information and reports.Semiconductor Processing Technicians | 2.1% | L2 | L2L2 | 68% | 38 min | Accountability, Access to systems |
| Manipulate valves, switches, and buttons, or key commands into control panels to start semiconductor processing cycles.Semiconductor Processing Technicians | 2.1% | L1 | L1L1 | 12% | 8 min | Physical presence, Accountability, Access to systems |
| Load, unload, or adjust materials or products on conveyors by hand, by using lifts, hoists, and scoops, or by opening gates, chutes, or hoppers.Conveyor Operators and Tenders | 2.0% | L0 | L0L0 | 4% | 22 min | Physical presence, Accountability, Access to systems |
| Record production data such as weights, types, quantities, and storage locations of materials, as well as equipment performance problems and downtime.Conveyor Operators and Tenders | 2.0% | L2 | L2L2 | 42% | 18 min | Physical presence, Access to systems |
| Etch, lap, polish, or grind wafers or ingots to form circuitry and change conductive properties, using etching, lapping, polishing, or grinding equipment.Semiconductor Processing Technicians · supplemental task | 2.0% | L1 | L1L1 | 15% | 1.5 h | Physical presence, Access to systems |
| Load and unload equipment chambers and transport finished product to storage or to area for further processing.Semiconductor Processing Technicians | 2.0% | L0 | L0L0 | 5% | 25 min | Physical presence, Access to systems |
| Observe conveyor operations and monitor lights, dials, and gauges to maintain specified operating levels and to detect equipment malfunctions.Conveyor Operators and Tenders | 1.9% | L2 | L2L2 | 50% | 4.2 h | Physical presence, Access to systems |
| Clean semiconductor wafers using cleaning equipment, such as chemical baths, automatic wafer cleaners, or blow-off wands.Semiconductor Processing Technicians | 1.9% | L0 | L0L1 | 8% | 38 min | Physical presence, Access to systems |
| Set, adjust, and readjust computerized or mechanical equipment controls to regulate power level, temperature, vacuum, and rotation speed of furnace, according to crystal growing specifications.Semiconductor Processing Technicians · supplemental task | 1.9% | L1 | L1L2 | 32% | 45 min | Physical presence, Access to systems |
| Weigh or measure materials and products, using scales or other measuring instruments, or read scales on conveyors that continually weigh products, to verify specified tonnages and prevent overloads.Conveyor Operators and Tenders · supplemental task | 1.9% | L1 | L1L2 | 22% | 15 min | Physical presence, Access to systems |
| Stop equipment or machinery and clear jams, using poles, bars, and hand tools, or remove damaged materials from conveyors.Conveyor Operators and Tenders | 1.9% | L0 | L0L0 | 4% | 15 min | Physical presence, Accountability, Access to systems |
| Position deflector bars, gates, chutes, or spouts to divert flow of materials from one conveyor onto another conveyor.Conveyor Operators and Tenders · supplemental task | 1.9% | L0 | L0L0 | 4% | 5 min | Physical presence, Accountability, Access to systems |
| Collect samples of materials or products, checking them to ensure conformance to specifications or sending them to laboratories for analysis.Conveyor Operators and Tenders · supplemental task | 1.9% | L1 | L1L1 | 16% | 18 min | Physical presence, Accountability, Access to systems |
Show the other 59 tasks
| Task statement (O*NET occupation) | Weight | Level | Sonnet · Haiku | Share | Human time | Barriers |
|---|---|---|---|---|---|---|
| Study work orders, instructions, formulas, and processing charts to determine specifications and sequence of operations.Semiconductor Processing Technicians | 1.9% | L2 | L2L2 | 68% | 30 min | Access to systems |
| Manipulate controls, levers, and valves to start pumps, auxiliary equipment, or conveyors, and to adjust equipment positions, speeds, timing, and material flows.Conveyor Operators and Tenders · supplemental task | 1.9% | L1 | L1L1 | 18% | 8 min | Physical presence, Access to systems |
| Count, sort, and weigh processed items.Semiconductor Processing Technicians · supplemental task | 1.9% | L0 | L1L0 | 12% | 30 min | Physical presence, Access to systems |
| Place semiconductor wafers in processing containers or equipment holders, using vacuum wand or tweezers.Semiconductor Processing Technicians | 1.8% | L0 | L0L0 | 4% | 6 min | Physical presence, Access to systems |
| Thread strapping through strapping tools and secure battens with strapping to form protective pallets around extrusions.Conveyor Operators and Tenders · supplemental task | 1.8% | L0 | L0L0 | 4% | 28 min | Physical presence |
| Load semiconductor material into furnace.Semiconductor Processing Technicians · supplemental task | 1.8% | L0 | L0L0 | 5% | 22 min | Physical presence, Access to systems |
| Press console buttons to deflect packages to predetermined accumulators or reject lines.Conveyor Operators and Tenders · supplemental task | 1.8% | L0 | L2L0 | 35% | 3 min | Physical presence, Access to systems |
| Monitor operation and adjust controls of processing machines and equipment to produce compositions with specific electronic properties, using computer terminals.Semiconductor Processing Technicians · supplemental task | 1.8% | L2 | L2L2 | 42% | 1.3 h | Physical presence, Accountability, Access to systems |
| Clean, sterilize, and maintain equipment, machinery, and work stations, using hand tools, shovels, brooms, chemicals, hoses, and lubricants.Conveyor Operators and Tenders · supplemental task | 1.8% | L0 | L0L0 | 5% | 45 min | Physical presence, Access to systems |
| Read production and delivery schedules, and confer with supervisors, to determine sorting and transfer procedures, arrangement of packages on pallets, and destinations of loaded pallets.Conveyor Operators and Tenders · supplemental task | 1.7% | L2 | L2L2 | 52% | 20 min | Access to systems |
| Contact workers in work stations or other departments to request movement of materials, products, or machinery, or to notify them of incoming shipments and their estimated delivery times.Conveyor Operators and Tenders · supplemental task | 1.7% | L2 | L2L2 | 52% | 5 min | Access to systems |
| Align photo mask pattern on photoresist layer, expose pattern to ultraviolet light, and develop pattern, using specialized equipment.Semiconductor Processing Technicians · supplemental task | 1.7% | L0 | L0L1 | 12% | 45 min | Physical presence, Access to systems |
| Affix identifying information to materials or products, using hand tools.Conveyor Operators and Tenders · supplemental task | 1.7% | L0 | L0L0 | 4% | 3 min | Physical presence, Access to systems |
| Distribute materials, supplies, and equipment to work stations, using lifts and trucks.Conveyor Operators and Tenders | 1.6% | L0 | L0L1 | 8% | 45 min | Physical presence, Accountability, Access to systems |
| Calculate etching time based on thickness of material to be removed from wafers or crystals.Semiconductor Processing Technicians · supplemental task | 1.6% | L3 | L3L3 | 85% | 10 min | Access to systems |
| Clean and maintain equipment, including replacing etching and rinsing solutions and cleaning bath containers and work area.Semiconductor Processing Technicians | 1.6% | L0 | L0L0 | 6% | 1.0 h | Physical presence, Accountability, Access to systems |
| Move, assemble, and connect hoses or nozzles to material hoppers, storage tanks, conveyor sections or chutes, and pumps.Conveyor Operators and Tenders · supplemental task | 1.6% | L0 | L0L0 | 4% | 18 min | Physical presence, Access to systems |
| Inspect equipment for leaks, diagnose malfunctions, and request repairs.Semiconductor Processing Technicians · supplemental task | 1.6% | L1 | L1L2 | 38% | 1.0 h | Physical presence, Accountability, Access to systems |
| Inform supervisors of equipment malfunctions that need to be addressed.Conveyor Operators and Tenders | 1.6% | L1 | L1L2 | 42% | 8 min | Physical presence, Access to systems |
| Connect reactor to computer, using hand tools and power tools.Semiconductor Processing Technicians · supplemental task | 1.5% | L0 | L0L1 | 8% | 2.8 h | Physical presence, Accountability, Access to systems |
| Scribe or separate wafers into dice.Semiconductor Processing Technicians · supplemental task | 1.5% | L0 | L0L1 | 10% | 45 min | Physical presence, Access to systems |
| Join sections of conveyor frames at temporary working areas, and connect power units.Conveyor Operators and Tenders · supplemental task | 1.4% | L0 | L0L0 | 4% | 1.3 h | Physical presence, Accountability, Access to systems |
| Stamp, etch, or scribe identifying information on finished component according to specifications.Semiconductor Processing Technicians · supplemental task | 1.4% | L1 | L1L1 | 18% | 10 min | Physical presence, Access to systems |
| Measure and weigh amounts of crystal growing materials, mix and grind materials, load materials into container, and monitor processing procedures to help identify crystal growing problems.Semiconductor Processing Technicians · supplemental task | 1.3% | L1 | L1L1 | 15% | 1.3 h | Physical presence, Access to systems |
| Record temperatures, amounts of materials processed, or test results on report forms.Cooling and Freezing Equipment Operators and Tenders | 1.2% | L2 | L2L2 | 58% | 18 min | Physical presence, Accountability, Access to systems |
| Monitor pressure gauges, ammeters, flowmeters, thermometers, or products, and adjust controls to maintain specified conditions, such as feed rate, product consistency, temperature, air pressure, and machine speed.Cooling and Freezing Equipment Operators and Tenders | 1.2% | L1 | L1L2 | 35% | 4.3 h | Physical presence, Accountability, Access to systems |
| Measure or weigh specified amounts of ingredients or materials, and load them into tanks, vats, hoppers, or other equipment.Cooling and Freezing Equipment Operators and Tenders · supplemental task | 1.2% | L0 | L0L1 | 8% | 25 min | Physical presence, Access to systems |
| Read dials and gauges on panel control boards to ascertain temperatures, alkalinities, and densities of mixtures, and turn valves to obtain specified mixtures.Cooling and Freezing Equipment Operators and Tenders | 1.1% | L1 | L1L1 | 25% | 15 min | Physical presence, Access to systems |
| Repair or replace equipment components or parts such as blades, rolls, and pumps.Conveyor Operators and Tenders · supplemental task | 1.1% | L1 | L1L1 | 12% | 1.5 h | Physical presence, Accountability, Access to systems |
| Adjust machine or freezer speed and air intake to obtain desired consistency and amount of product.Cooling and Freezing Equipment Operators and Tenders · supplemental task | 1.1% | L1 | L1L1 | 20% | 15 min | Physical presence, Access to systems |
| Weigh packages and adjust freezer air valves or switches on filler heads to obtain specified amounts of product in each container.Cooling and Freezing Equipment Operators and Tenders · supplemental task | 1.1% | L0 | L0L1 | 10% | 12 min | Physical presence, Access to systems |
| Load and position wrapping paper, sticks, bags, or cartons into dispensing machines.Cooling and Freezing Equipment Operators and Tenders · supplemental task | 1.1% | L0 | L0L0 | 4% | 12 min | Physical presence |
| Start machinery, such as pumps, feeders, or conveyors, and turn valves to heat, admit, or transfer products, refrigerants, or mixes.Cooling and Freezing Equipment Operators and Tenders | 1.0% | L1 | L1L1 | 15% | 15 min | Physical presence, Accountability, Access to systems |
| Start agitators to blend contents, or start beater, scraper, and expeller blades to mix contents with air and prevent sticking.Cooling and Freezing Equipment Operators and Tenders · supplemental task | 1.0% | L1 | L1L1 | 15% | 4 min | Physical presence, Access to systems |
| Sample and test product characteristics such as specific gravity, acidity, and sugar content, using hydrometers, pH meters, or refractometers.Cooling and Freezing Equipment Operators and Tenders · supplemental task | 1.0% | L1 | L1L1 | 15% | 15 min | Physical presence, Accountability, Access to systems |
| Inspect and flush lines with solutions or steam, and spray equipment with sterilizing solutions.Cooling and Freezing Equipment Operators and Tenders · supplemental task | 0.9% | L0 | L0L0 | 6% | 52 min | Physical presence, Accountability, Access to systems |
| Monitor machine operations to detect malfunctions and report or resolve problems.Adhesive Bonding Machine Operators and Tenders | 0.9% | L1 | L1L2 | 32% | 4.3 h | Physical presence, Access to systems |
| Align and position materials being joined to ensure accurate application of adhesive or heat sealing.Adhesive Bonding Machine Operators and Tenders | 0.9% | L0 | L0L0 | 4% | 8 min | Physical presence, Access to systems |
| Place or position containers into equipment, and remove containers after completion of cooling or freezing processes.Cooling and Freezing Equipment Operators and Tenders · supplemental task | 0.9% | L0 | L0L0 | 4% | 15 min | Physical presence, Access to systems |
| Scrape, dislodge, or break excess frost, ice, or frozen product from equipment to prevent accumulation, using hands and hand tools.Cooling and Freezing Equipment Operators and Tenders · supplemental task | 0.9% | L0 | L0L0 | 2% | 30 min | Physical presence, Access to systems |
| Stir material with spoons or paddles to mix ingredients or allow even cooling and prevent coagulation.Cooling and Freezing Equipment Operators and Tenders · supplemental task | 0.8% | L0 | L0L0 | 2% | 20 min | Physical presence, Access to systems |
| Adjust machine components according to specifications such as widths, lengths, and thickness of materials and amounts of glue, cement, or adhesive required.Adhesive Bonding Machine Operators and Tenders | 0.8% | L1 | L1L1 | 15% | 22 min | Physical presence, Access to systems |
| Start machines, and turn valves or move controls to feed, admit, apply, or transfer materials and adhesives, and to adjust temperature, pressure, and time settings.Adhesive Bonding Machine Operators and Tenders | 0.8% | L1 | L1L1 | 12% | 18 min | Physical presence, Access to systems |
| Activate mechanical rakes to regulate flow of ice from storage bins to vats.Cooling and Freezing Equipment Operators and Tenders · supplemental task | 0.8% | L0 | L1L0 | 10% | 10 min | Physical presence, Accountability, Access to systems |
| Correct machinery malfunctions by performing actions such as removing jams, and inform supervisors of malfunctions as necessary.Cooling and Freezing Equipment Operators and Tenders | 0.8% | L1 | L1L1 | 15% | 20 min | Physical presence, Access to systems |
| Insert forming fixtures, and start machines that cut frozen products into measured portions or specified shapes.Cooling and Freezing Equipment Operators and Tenders · supplemental task | 0.8% | L0 | L0L1 | 6% | 18 min | Physical presence, Access to systems |
| Assemble equipment, and attach pipes, fittings, or valves, using hand tools.Cooling and Freezing Equipment Operators and Tenders | 0.8% | L0 | L0L0 | 4% | 1.3 h | Physical presence, Accountability, Access to systems |
| Mount or load material such as paper, plastic, wood, or rubber in feeding mechanisms of cementing or gluing machines.Adhesive Bonding Machine Operators and Tenders | 0.8% | L0 | L0L0 | 2% | 10 min | Physical presence, Access to systems |
| Maintain production records such as quantities, dimensions, and thicknesses of materials processed.Adhesive Bonding Machine Operators and Tenders | 0.8% | L2 | L2L2 | 55% | 18 min | Physical presence, Access to systems |
| Read work orders and communicate with coworkers to determine machine and equipment settings and adjustments and supply and product specifications.Adhesive Bonding Machine Operators and Tenders | 0.8% | L2 | L2L2 | 48% | 18 min | Physical presence, Trust and care, Access to systems |
| Remove and stack completed materials or products, and restock materials to be joined.Adhesive Bonding Machine Operators and Tenders | 0.8% | L0 | L0L0 | 4% | 12 min | Physical presence |
| Examine and measure completed materials or products to verify conformance to specifications, using measuring devices such as tape measures, gauges, or calipers.Adhesive Bonding Machine Operators and Tenders | 0.8% | L0 | L0L1 | 10% | 5 min | Physical presence, Access to systems |
| Fill machines with glue, cement, or adhesives.Adhesive Bonding Machine Operators and Tenders | 0.8% | L0 | L0L0 | 4% | 12 min | Physical presence, Access to systems |
| Observe gauges, meters, and control panels to obtain information about equipment temperatures and pressures, or the speed of feeders or conveyors.Adhesive Bonding Machine Operators and Tenders | 0.8% | L1 | L1L1 | 22% | 12 min | Physical presence, Access to systems |
| Perform test production runs and make adjustments as necessary to ensure that completed products meet standards and specifications.Adhesive Bonding Machine Operators and Tenders | 0.7% | L1 | L1L1 | 20% | 52 min | Physical presence, Access to systems |
| Transport materials, supplies, and finished products between storage and work areas, using forklifts.Adhesive Bonding Machine Operators and Tenders | 0.6% | L0 | L0L0 | 4% | 18 min | Physical presence, Accountability, Access to systems |
| Remove jammed materials from machines and readjust components as necessary to resume normal operations.Adhesive Bonding Machine Operators and Tenders | 0.6% | L0 | L0L0 | 4% | 18 min | Physical presence, Access to systems |
| Clean and maintain gluing and cementing machines, using solutions, lubricants, brushes, and scrapers.Adhesive Bonding Machine Operators and Tenders · supplemental task | 0.6% | L0 | L0L0 | 4% | 35 min | Physical presence, Access to systems |
| Measure and mix ingredients to prepare glue.Adhesive Bonding Machine Operators and Tenders · supplemental task | 0.4% | L1 | L1L1 | 10% | 20 min | Physical presence, Access to systems |
Level: consensus of the two models (the lower level when they disagree). Share: part of the task’s working time an agent could take over. Human time: minutes a competent person needs for one instance, as estimated by the models.
Against other measures
Exposure is not delegation
| Measure | Value | Percentile |
|---|---|---|
| ADI (this index) | 17.5% | 28 |
| Eloundou et al. (2024), GPT exposure β | 0.153 | 27 |
| Felten et al. (2021), AI occupational exposure | -0.815 | 29 |
| Webb (2020), AI patent exposure | 76.588 | 68 |
| Eisfeldt et al. (2026), generative AI exposure | 0.098 | 37 |
| Anthropic Economic Index, observed use | 0 | 16 |
Earlier indices measure whether AI can touch a task; ADI measures how much of it an agent can carry out from a goal. – : the source does not cover this occupation.
Same sub-major group (81)
Neighbouring occupations
Dashed line: stationary plant and machine operators not elsewhere classified (17.5%).
Cite this record
Text
Espinal Maya, Cristian, and Santiago Jiménez Londoño. 2026. ADI v2026.1: Agent Delegability Index data, code and MCP server. Zenodo. https://doi.org/10.5281/zenodo.23552918. Record: Stationary plant and machine operators not elsewhere classified (ISCO-08 8189), https://balamlabs.org/adi/occupations/8189
BibTeX
@misc{espinal2026adidata,
title = {{ADI} v2026.1: Agent Delegability Index data, code and {MCP} server},
author = {Espinal Maya, Cristian and Jim{\'e}nez Londo{\~n}o, Santiago},
year = {2026},
publisher = {Zenodo},
version = {v2026.1},
doi = {10.5281/zenodo.23552918},
url = {https://doi.org/10.5281/zenodo.23552918},
note = {Record: Stationary plant and machine operators not elsewhere classified (ISCO-08 8189)}
}Machine-readable
The same record as static JSON, with its citation: /adi/v2026.1/isco/8189.json.